1.60mm Impedance Control Fr4 PCB Peelable Mask Surface Finishing
Production description :
this board is 3 layer rigid pcb. it is used for pose payment device . all of our board are met UL, ISO9001, TS1694 certification etc.no MOQ request for new boards, for repeat order, just meet 3sq.m.
PCB Flow Chart.pdf
Key Specifications of single PCB board :
| Production Types: | Rigid PCB |
| Layer : | 4Layer |
| Base Material : | KB FR4 fiber |
| Copper Thickness : | 1 oz |
| Board Thickness : | 1.0mm |
| Min. Finish Hole Size : | 8 mil (0.10mm) |
| Min. Line Width : | 4 mil |
| Min. Line Spacing : | 4 mil |
| Surface Finishing : | HAL LEAD FREE + PEELABLE MASK |
| Drilling hole tolerance: | +/-3 mil ( 0.075mm ) |
| Min Outline tolerance : | +/-4 mil ( 0.10mm ) |
| Working panel size : | max:1200mmX600mm (47'' X24'') |
| Outline profile: | Punching, Routing , CNC routing + V-cut |
| Solder mask : | LPI Solder mask, Peelable mask |
| Solder Mask Color : | Blue, black,yellow, matte green |
| Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
| Silkscreen color : | White |
| Twist and Bow : | no more than 0.75 % |
Quality Goal:
| Category | Performance indicator | Quality Goal |
| Delivery | Customer service rate | 99.9% |
| Semi Finished product | Process inspection pass rate | 100% |
| Finished product | FQA Rebate rate | 0.1% |
| Scrapped | 1L scrap rate | 0.5% |
| 2L scrap rate | 1% |
| Multi Layer scrap rate | 2% |
| Customers | Customer complaint rate | 0.8% |
| Customer return rate | 0.5% |
| Customer satisfaction | 99% |
Product Application Field :
FAQ
1. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
2. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
3. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
4. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
Product Tags:
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1.60mm Impedance Control Fr4 PCB Peelable Mask Surface Finishing Images
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