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FR4 Tg170 Material Impedance Control PCB 1.40mm Thickness Eight Layers pcb controlled impedance

Accuracy Electronics Technologies Co.,Ltd
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FR4 Tg170 Material Impedance Control PCB 1.40mm Thickness Eight Layers pcb controlled impedance

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Brand Name : ACCPCB

Model Number : P1074

Certification : ISO, UL, SGS,TS16949

Place of Origin : China

MOQ : 1-5PCS

Price : Negotiable

Payment Terms : L/C / T/T / Western Union / Paypal

Supply Ability : 50000SQ.M/PER MONTH

Delivery Time : 12-16days

Packaging Details : Vacuum packaging

Material : FR4tg170

Layer : 8L

Surface Finish : Immersion Gold

Thickness : 1.40mm

Min. hole size : 0.15mm

Copper thickness : 0.5 OZ--2.0OZ

Type : Electronic Board,Rigid board

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FR4 Tg170 Material Impedance Control PCB 1.40mm Thickness Eight Layers pcb controlled impedance

Key Specifications/Special Features :

Base Material : Nanya FR4
Board Thickness : 1.40 mm
Layers : 8 layers
Copper thickness : 2 / 1 / 1 / 1 / 1/ 1 / 1 / 2 OZ
Impedance : 100Ohm
Min. Hole Size : 0.15 mm
Min. Line Width : 0.1mm/4mil
Min. Line Spacing : 4/4mil(0.1/0.1mm)
Application: industial control board
Company type: Manufacturer/ Factory

Quality assurance :

Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications

Application:
Widely used in stage, Industrila control,computer,consuming electronics,security,automotive,power electronics,medical,telecom etc.

Lead Time :

Lead Time 2 / L 4 / L 6 / L 8 / L
Sample Order 3-5days 6-8days 10-12days 12-14days
Mass Production 7-9days 8-10days 12-15days 15-18days

FAQ :
1. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


2. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.


3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

4. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process


5. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. What are the main factors which will affect the price of PCB?

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

FR4 Tg170 Material Impedance Control PCB 1.40mm Thickness Eight Layers pcb controlled impedance


Product Tags:

custom printed circuit board

      

double sided fr4 pcb

      
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