Heavy Copper PCB 3.0 Mm Board Thickness Black Solder Mask for Power Amplifier
Key Specifications/Special Features:
Layer : 4 Layers
Base Material : FR4 tg150
Copper Thickness : 3 oz in all layer
Board Thickness : 3.0 mm
Min. Hole Size : 6 mil / 0. 15mm
Min. Line Width : 4 / 4 mil
Min. Line Spacing : 4 / 4 mil
Surface Finishing : Immersion gold ( au :2micron)
Fire-proof level : 94v0
Solder mask : Black
Certificate : UL, CQC, TS16949, ISO14000, ROHS
ACCPCB Technical Capability.pdf
Quality Goal:
| Category | Performance indicator | Quality Goal |
| Delivery | Customer service rate | 99.9% |
| Semi Finished product | Process inspection pass rate | 100% |
| Finished product | FQA Rebate rate | 0.1% |
| Scrapped | 1L scrap rate | 0.5% |
| 2L scrap rate | 1% |
| Multi Layer scrap rate | 2% |
| Customers | Customer complaint rate | 0.8% |
| Customer return rate | 0.5% |
| Customer satisfaction | 99% |
Quality assurance :
Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications
Product Application Field :
FAQ:
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
6. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
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